[" The termpereture dependence of resistances of Cu and undoped Si in the temperature range "],[300-400K" ,is best described by: "],[(1)" Linear increase for "Cu" ,exponential increase for si "],[[" (2) Linedr increase for "Cu," exponential decrease for "si," .Se mi "],[" (4) Linear increase for Cu,linear increase for si "," conductur cond."]]

The temperature dependence of resistance of Cu and undoped Si in the temperature range 300 -400 K, is best described by :

The temperature dependence of resistance of Cu and undoped Si in the temperature range 300 -400 K, is best described by :

The temperature dependence of resistances of Cu and undoped Si in the temperature range 300 - 400 K, is best described by :

The temperature dependance if resistances of Cu and undoped SI in the temperature range 300-400K, is best described by

Si and Cu are cooled to a temperature of 300 K , then resistivity

Si and Cu are cooled to a temperature of 300 K , then resistivity

In which substances does resistance decreases with increase in temperature? (a)Ag (b)Na (c)C (d)Cu

Si and Cu are cooled from 300 K to a temperative of 60 K. Then resistivity

In which of the following cases, the centre of mass of rod may be its centre ? (1) The linear mass density increases continuously from left to right. (2) The linear mass density decreases continuouly from let to right. (3) The linear mass density decreases from left to right up to centre and then increases. (4) The linear mass density increases form left to right upto a certain point (may not be the centre) and the decreases from the point till the end.