In the silver plating of copper, K[Ag(CN...

In the silver plating of copper, `K[Ag(CN)_(2)]` is used instead of `AgNO_(3)` . The reason is

A thin layer of Ag is formed on Cu

More voltage is required

`Ag^+` ions are completely removed from solution

Less availability of `Ag^+` ions, as Cu can not displace Ag from `[Ag(CN)_2]^–` ion

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IUPAC name for K[Ag(CN)_2] is

The charge on K[Ag(CN)_(2)] complex is

In the electroplating of silver, AgNO_(3) solution is usually used as an electrolyte.

AgCldarr+2KCN to K[Ag(CN)_(2)]+KCl

Two electrolytic cells containing CuSO_(4) and AgNO_(3) respectively are connected in series and a current is passed through them until 1 mg of copper is deposited in the first cell. The amount of silver deposited in the second cell during this time is approximately [Atomic weights of copper and silver are respectively 63.57 and 107.88 ]

In a silver plating system, an electrolysis current of 5.0 A is used for a certain time and 0.5 mol of silver is deposited. How many moles of copper and iron will be deposited in their respective plating system if an electrolysis current of 10.0 A is passed for twice the time for silver plating. ( Relative atomic mass of silver=107.3, of copper -63.54, of iron=55.85).

Assertion : Zinc is used for the recovery of silver from the complex [Ag(CN)_(2)]^(-) Reason : Zinc is more electropositive than silver and is a better reducing agent.

1.1081 gram of copper displaces 3.67 grams of silver from a solution of AgNo_(3) . The equivalent weight Ag is 107.88 . What is the equivalent weight of copper ?

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